KOREAN

Technical Development

Technical Development Technological Advantage
Technological Advantage
comparison of touch sensor module Use metal materials Operation algorithms

  • Rigid PCB

    Transparency X , Flexibility X

    • Most common method
    • For LED backlight  Needs complex structures
    • The effect of the sensitivity of the air gap.
    • Transparency X , Flexibility X Limited appearance design
    •  Touch board and main boards  Rising SMT costs.

  • Flexible PCB
    (none-transparency)

    Transparency X , Flexibility O

    • Only Flexibility
    • Made by flexible type PCB
    • Solved the air gap matter by attachment tape.
    • Very high PCB cost

  • Transparency
    Flexible PCB

    Transparency O , Flexibility O

    • Ensure transparency
    • Use Transparent PET
    • Easy to use with LED backlight and LCD
    • Flexible and various shapes are available

Quality satisfaction with improved durability

Compare silver ink product

  • Improved circuit cracking under bending stress
  • Improved progression risk under vibration stress
  • Improved connector contact durability ( No carbon, No contact resistance )

ICompared to ITO/Silver + FPCB combination product, Cost reduction of more than 50%

Using capacitive touch IC and MCU, simple touches and wheel/slide operations are available.